The Path to a better future is right in front of you
Ira A Fulton School of Engineering
M.S.E. in Material Science and Engineering - Semiconductor Processing and Packaging
The electronics industry has grown to become a $2 trillion-dollar market, exceeding investments made in other industries such as transportation, steel, etc. Businesses require an educated global workforce t support this ever-expanding and technologically challenging industry. In response to this demand, Arizona State University (ASU) in collaboration with industry has established a focused and multidisciplinary Master of Science in Engineering program.
The fast-paced and global nature of technologically challenging microelectronics industry necessitates an educational offering that is up-to-date, as well as, flexible for diverse and globally-based learners/students. In recognition of this need, Arizona State University which has strong collaborative programs with many microelectronics industry leaders has developed the Semiconductor Processing and Packaging program.
Classification: Doctoral/Research University—Extensive
Loans Offered: Financial support is available in the form of scholarships, grants, loans and outside resources. Almost everyone, regardless of income, can qualify for some form of financial aid.
ASU FAFSA Code: 001081.
Locale: Midsize City
Size & Settings: 0-999